Focusing on semiconductor test boards, MEMS probe cards and advanced packaging based on ceramic substrate, ZENFOCUS provides highly competitive high-end products and high-quality services to global integrated circuit chip design companies, packaging and testing plants, and wafer manufacturing plants through independent research and development, production and sales.
| ZENFOCUS thin-film substrate technical route | |||
|---|---|---|---|
| Time | 2022.H2 | 2023.H1 | 2023.H4 |
| Wafer | 14nm | 7nm | 5nm |
| LTCC Substate Size | 150*150nm | 200*200nm | 300*300nm |
| LTCC Satck up | 20Layer | 30Layer | >50Layer |
| LTCC Pad Pitch | 250μm | 150μm | 120μm |
| LTCC Line/Space | 100/100μm | 50/50μm | 30/50μm |
| LTCC Flatness | ≤ 10μm | ≤ 10μm | ≤ 10μm |
| Thin Film Stack up | 1Layer | 3Layer | 6Layer |
| Thin Film Sad Pitch | 85μm | 50μm | 30μm |
| Thin Film Line/Space | 18/25μm | 10/10μm | 5/5μm |
Focusing on semiconductor test boards, MEMS probe cards and advanced packaging based on ceramic substrate, ZENFOCUS provides highly competitive high-end products and high-quality services to global integrated circuit chip design companies, packaging and testing plants, and wafer manufacturing plants through independent research and development, production and sales.
Focusing on semiconductor test boards, MEMS probe cards and advanced packaging based on ceramic substrate, ZENFOCUS provides highly competitive high-end products and high-quality services to global integrated circuit chip design companies, packaging and testing plants, and wafer manufacturing plants through independent research and development, production and sales.
